Tin Specification MIL-T-10727
Tin Plating Specification: MIL-T-10727
| Spec. | Thickness | Comment |
| MIL-T- 10727C |
As specified on drawing. Thickness guide (not part of spec.) as follows: |
Please note: This specification is provided for reference purposes only as it has been superceded by ASTM-B-545 and ASTM-B-339. |
| Type I | ---------------- | Electrodeposited. Use ASTM-B-545 as guideline. |
| .0001-.00025" | Flash for soldering | |
| .0002-.0004" | To prevent galling and seizing. | |
| .0003 min. | Where corrosion resistance is important | |
| .0002-.0006" | To prevent formation of case hardening during nitriding. | |
| Type II | ---------------- | Hot dipped |
Tin & Tin Plating
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