Hot Solder Dip Prevents Rust & Oxidation

What Is Hot Solder Dipping?

Hot solder dip is the process of immersing a part into a bath of a molten tin/lead alloy at a temperature greater than at 370°F (188°C). The coating that's produced consists of a very thin intermetallic layer that first forms at the interface of the base material and the tin (for example, when dipping copper or copper alloys, a copper/tin alloy is formed) followed by a layer of pure solder. Note: no intermetallics of lead form, only those of tin and the base metal.

Hot Solder Dipping Has Significant Benefits

 

  • Easier To Solder

    Solder coatings are easier to solder than those of pure tin, since the lower melting point of the solder allows for a variety of heating methods.
  • Restores Solderability

    Solder by its very nature is solderable, which makes it a desirable finish for electronic component assembly.
  • Prevents Rusting

    For steel, the hot solder coating prevents the base material from rusting.
  • Prevents Oxidizing

    For copper and copper alloys, the hot solder coating prevents the base material from oxidizing.
  • Wear & Corrosion Resistant

    A solder layer provides greater wear and corrosion resistance than that of most base materials.

Hot Solder Dipping Prevents Whisker Growth

The presence of lead is the only proven strategy for preventing the formation of whiskers.

Hot Solder Dip Meets ASTM A1074-11 Specifications

Hi-Tech Plating & Tinning processes to ASTM A1074-11 and all MIL specs.  For your convenience, you can download the ASTM A1074-11 Specifications here.

Soldalum For Aluminum

Soldalum is a registered process for applying hot solder dip to aluminum without blistering occurring. It is used on critical aluminum components where whiskers and blisters are not an option. Soldalum also increases shelf life. Please specify Soldalum when you send us a quote.

Hot Solder Coating Versus Electroplated Coatings

The hot solder dip process is an alternative to electroplating, and provides specific benefits over electroplating:

  • Less porous than electroplating.
  • More ductile than electroplating.
  • Virtually stress-free.
  • More economical than electroplating.
  • Better corrosion resistance than electroplating.
  • Penetrates and coats inside walls of many "through" holes.

Hot Solder Dip Disadvantages.

The thickness of a coating provided by Hot Solder Dipping is not as well controlled when compared to that provided by electroplating methods. Hot solder dipping should not be used when tight tolerances are required or when the base part has fine details that could be obscured by a thicker plating layer.

Call The Tinning Company Today

The Tinning Company will work with you to ensure that the right type of plating is selected for your application. Put our expertise - and our world-class quality and service - to work for you today.